Taiwan-based Digitimes has a report that two Taiwanese semiconductor companies are assembling the next generation iPhone, dubbed as "iPhone 3.0" and the first batch shipment is estimated to be around 5 million units.
The Taiwanese companies have reportedly landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor to be used in the next iPhone model. Here is the chip and key component list for the next iPhone:
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